Spring 2024 - Chemical Engineering 4420 " Special Topics Course"
Week 1 - Students where introduced to the fundamentals of working in a cleanroom and reviewed machines that will be utilized during the course.
Week 2 - Students began with an introduction to Ellipsometry and completed test scans followed by thin film thickness measurement
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Image 1 - Intro to Ellipsometry
Image 2 - Thin Film Thickness Measurement
Week 3 - Sample preparation began with resist spincoating, first layer exposure/alignment and microscopic inspection
Image 1 - Microscopic Inspection
Image 2 - Sample cleaning
Image 3 - Sample Prep
Image 4 - Exposure/Alignment
Week 4 & 5 - Students prepped samples for the dopant layer application. Next, students checked the alignment with previous markers etched in their wafers then applied the dopant layer. The organic layer of the dopant was removed by O2 Plasma then diffused into the silicon by Rapid Thermal Annealing.
Image 1 - O2 Plasma Removal
Image 2 - Dopant layer application
Image 3 - Development
Image 4 - Rapid Thermal Annealing
Week 6 - Students etched the glass layer from their samples in preparation for application of the second layer
Image 1 - HF Etching
Image 2 - Microscopic Inspection
Week 7 - This week students completed the second layer application and verified both layers. The samples were prepped for the final layer
Image 1 - Resist Spincoating
Image 2 - Class Discussion
Image 3 - Second Layer Etch
Image 4 - Microscopic Inspection
Week 8 & 9 - Students applied the final layer of their samples, deposited the final metal layer, confirmed an electrical current then measured the electrical properties by AFM
Image 1 - Probe Station
Image 2 - Ebeam Metal Layer Deposition
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Image 3 - AFM
Image 4 - AFM Sample Prep
Week 10 - Students completed the last step to device fabrication by collecting charge data from their newly fabricated devices.
